Laser diode stacks develop heat in very confined spaces, and this must be reliably transported away to avoid affecting the laser's delicate focus. AlN conductor discs, coated with copper using "AMB technology", can solve this problem.
After grinding, the substrates are screenprinted
with titanium-silver-copper paste. In high precision graphite moulds and under protective gas, these substrates and copper foils are soldered together
at 920 degrees celcius. Just like in conventional circuit board technology, the surface is then printed with a resist and the copper selectively etched.
The result is highly heat-conductive ceramic conductor plate which, because of the copper thickness of up to 500 micrometers, can carry high currents.